cid:1DF0B30029324E7386C12966A9A0BE91@bevtwi2014pc

 

Seminars Mr. Hanson will instruct in the upcoming months.

 

Key Issues for EMI/EMC

Aug 28-29, 2017

Jet Propulsion Labs

Pasadena, CA

Sponsored by UCLA

 

PCB West 2017

Santa Clara Convention Center, Santa Clara CA

Tuesday, September 12 – Key Issues for EMI/EMC: How to Design & Build a Compliant System

Wednesday, September 13 – Achieving Signal Integrity & Meeting EMI Radiation Requirements using High-Speed Connectors

Wednesday, September 13 – Designing the interface for DDR 3/4 and PCIe 3/4 Buses

Thursday, September 14 – The Complete Guide to Understanding Transmission Lines

 

Essentials of Electronic Technology-A Crash Course

Jan 18-20, 2018

Columbia, MD for Applied Technology Institute (ATI)

 

Essentials of Digital Technology-A Crash Course

Feb 13-14, 2018

Columbia, MD for ATI

 

 

Seminar at your Location? Consulting? Question?

Contact us via Email: americomseminars@aol.com

We want to hear from you.

 

 

Previous Seminars

 

High Speed Digital Design and PCB Layout

May 9-11, 2017

Columbia, MD

Applied Technology Institute

 

EMC PCB Design Integration

June 6-8, 2017 (plus option 9th)

Gaithersburg, MD

Washington Laboratories

 

Key Issues for EMI/EMC:  How to Design & Build a Compliant Electronic System

August 4-16, 2017,  Penang Malaysia

Sponsored by Mindshare, Inc.

 

High Speed Digital Design: Signal Integrity Issues

Beaverton (Portland) OR

July 28 and 29, 2016

 

EMC PCB Design and Integration

Washington Labs

Gaithersburg, MD

August 9-11, 2016

 

PCB West 2016, Santa Clara Convention

Tuesday September 13, 2016 9 a.m. – 5 p.m.

“Key Issues for EMI/EMC: How to Design and Build a Compliant System”

Wednesday. September 14, 2016 4 pm – 5 pm

“Enhancing High-speed Transmissions Using Pre-Emphasis and Equalization Techniques”

Thursday, September 15, 2016 11 a.m. – 12 p.m.

“Achieving Signal Integrity & Meeting EMI Radiation Requirements Using High-Speed Connectors”

Thursday, September 15, 2016 1:30 pm – 5 p.m.

“Designing the Interface for  DDR 3 & 4 and PCBs 3 & 4 Buses”

Sign up for the training:  Email Alyson Corey at acorey@upmediagroup.com. 

 

Key Issues for EMI/EMC: how to Design and Build a Compliant System

UCLA, Los Angeles, CA

June 1-3, 2016

 

High Speed Digital Design: Signal Integrity Issues

Beaverton (Portland) OR

April 28 and 29, 2016

 

 

Enhancing Reliability of Electronic Products

How to insure reliability during the prototype development phase.

Beaverton (Portland) OR

October 29, 2015

 

Key Issues of EMI/EMC

How to build a compliant product.

Beaverton (Portland) OR

October 30, 2015

 

High Speed Digital Design & PCB Layout

Sponsored by Washington Labs

Gaithersburg, MD

Nov 10-12, 2015

Cost Conscious Test Strategies for Electronic Products

Beaverton (Portland) OR

July 30-31, 2015

 

Achieving Signal Integrity and
Meeting EMI Radiation Requirements using High Speed Connections

PCB Design Conference: Santa Clara, CA

September 16, 2015

 

Cost Conscious Test Strategies for Electronic Products

PCB Design Conference: Santa Clara, CA

September 17, 2015

 

High Speed Digital Design

Sponsored by EDA Technologies

Pretoria, South Africa

Sept 28-29, 2015

 

High Speed Digital Design

Sponsored by EDA Technologies

Cape Town, South Africa

Oct 1-2, 2015

 

Signal Integrity for the Design Engineer and
Designing the Mobile Platform Interfaces (UFS, M-PCIe, and LPDDR3)

Qualcomm: San Diego, CA

July 23-24, 2015

 

Testing SMT (Surface Mount Technology)

June 9-10, 2015

Nepcon: Penang, Malaysia

 

Key Issues of EMI (Electromagnetic Interference)

  June 11, 2015

Nepcon: Penang, Malaysia

 

Essential Steps for Signal Integrity

UCLA, Los Angeles, CA

May 4-5, 2015

 

Cost Conscious Test Strategies for Electronic Products

IPC APEX Conference, San Diego, CA

Feb 24, 2015

Designing the Mobile Platform Memory Interfaces

Sept. 9, 2014

Vias and Their Effects on High Speed Signals

Sept 10, 2014

Sponsored by PCB West 2014

 

Key Issues of EMI/EMC, How to Build a Compliant System

Sept 29-30, 2014

Sponsored by Tinker Air Force Base

 

Key Issues of EMI/EMC, How to Build a Compliant System

Oct 9-10, 2014

Sponsored by Tinker Air Force Base

 

Dublin-Pleasanton CA Seminars

March 10-14, 2014

Sponsors Polar Instruments and Mindshare

High Speed Digital Design & EMI

March 31- April 1, 2014

Sponsored by Qualcomm, San Diego TX

 

Littleton MA Seminars

April 7-11, 2014

Sponsors Polar Instruments, Mindshare, and Washington Labs

 

Signal Integrity for the Design Engineer
Apr 8-9, 2013
August 12-13, 2013
Dec 2-3, 2013
sponsored by Texas Instruments

 

High Speed Digital Design, Advanced High Speed Digital Design, and EMI
Nov 20-22, 2013 (High Speed Digital Design)
Nov 25-26, 2013 (Advanced High Speed Digital Design)
Nov 27, 2013 (EMI)
LRDE
India DOD

Key Issues for EMI/EMC, How to Build a Compliant System
Feb 18, 2013
June 24, 2013
Oct 28, 2013
sponsored by Texas Instruments

Key Issues of High Speed Digital Design
Oct 14, 2013
SMTA International Fort Worth, TX

IPC APEX India
Key Issues for EMI/EMC
Vias and their Effects on High Speed Signals
ABCs of Grounding including Analog/Digital Planes
Differential Signaling-Trade Offs for Optimization of Signal Quality and Routing
Designing the Interface for DDR 3/4 and PCIe 3/4 Buses
Aug 26-29, 2013
Bangalore, India

High Speed Digital Design and PCB Layout for EDA Technologies
Oct 2-4, 2013, Capetown, South Africa
Oct 7-9, 2013 Pretoria, South Africa

The High Speed Digital Design One Day Series for Siemens
Sept 3-6, 2013
Nashville, TN

PCB Design Conference
S Parameters and Transmission Lines for High Speed Analysis, Sept 25, 2013
Vias and Their Effects on High Speed Signals, Sept 25, 2013
DDR ¾ and PCIe ¾ Technology, Sept 26, 2013
Santa Clara, CA

Key Issues for EMI/EMC
Aug 19-20, 2013
at Tinker Air Force Base, Oklahoma City

Selected Topics of Advanced and High Speed Digital Design
March 19-22, 2013 at H/P in Barcelona
sponsored by Mindshare 

 

Essential Steps for Signal Integrity
April 15-17 2013, Los Angeles, CA
sponsored by UCLA

High-Speed Digital Design/EMI
February 2013, Capetown, South Africa
sponsored by EDA Technologies

Key Issues of EMI/EMC
Oct 15, 2012, San Diego, CA
sponsored by Qualcomm

High Speed Digital Design/Advanced High Speed Digital Design
Nov 26-30, 2012, Bangalore, India
sponsored by Mindshare

Transmission Lines
December 11, 2012, Sunnyville, CA
sponsored by Maxim

Signal Integrity for the Design Engineer
June 27-28, 2012, Newark, CA
sponsored by Elliott Labratories

Differential Signaling and Clock Distribution Control
Sept 10, 2012, San Diego, CA
sponsored by Qualcomm

Achieving Signal Integrity and Meeting EMI Radiation Requirements using High Speed Connections
Sept 25, 2012, Santa Clara, CA
PCB Design Conference West

EMI/EMC for the Design Engineer
Jan 11-13, 2012 HP Barcelona, sponsored by Mindshare

High Speed Digital Design and PCB Layout
Jan 17-19, 2012, HP Houston, sponsored by Mindshare

Transmission Lines
Apr 16, 2012, San Diego, CA
sponsored by Qualcomm


High-Speed Digital Design/EMI
April 30 - May 4, Gaithersburg, MD
sponsored by Washington Laboratories
Click here for more info

Crosstalk, Layer Stacking, Separating Analog/Digital Planes, and Terminations

May 9, 2102 Sunnyvale, CA
May 11, 2012 Portland, OR
sponsored by Maxim Integrated Products, Inc.

Basic/Advanced High-Speed Digital Design Topics and PCB Layout
June 4-6, 2012
Lockheed-Martin Company, Goleta, California
On-site instructor for Mindshare, Inc.

Crosstalk, Layer Stacking, Separating Analog/Digital Planes, and Terminations
June 8, 2012, San Diego, CA
sponsored by Qualcomm

Bypassing, Power Delivery, Vias, Connectors, and Buses
Aug 5, 2012, San Diego, CA
sponsored by Qualcomm

 

Cadence Blog: Mr. Hanson presents on Power

 

Seminar at your Location? Consulting? Question?

Contact us via Email: americomseminars@aol.com

We want to hear from you.

 

Description: Description: Description: Description: Description: Description: Description: Description: Description: Description: Description: Description: Description: Description: Description: Description: Description: Description: Description: Description: Description: Description: Description: Description: Description: Description: Description: Description: Description: Description: Description: Description: Description: Robert Hanson
Robert Hanson, M.S.E.E., President, Americom Seminars, Internationally Recognized Expert with over 40 years of experience.  Mr. Hanson's Qualifications

Americom Seminars has provided outstanding electrical engineering seminars for over 25 years.

Contact us via Email: americomseminars@aol.com

Americom Seminars, Inc.

2360 Corporate Circle, Suite 400

Henderson, NV 89074-7722

 

Phone:

775-841-9432

 

 

Comments about the web pages, contact Jim Hanson at hansonjb@gmail.com

 

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